Thermal Interface Material - FRD - Shenzhen FRD Science & Technology Co., Ltd.

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Thermal Interface Material

上市日期： 2026-01-07

Basic Description：

Thermal conductivity up to 120W/m-K,

Advanced FIP technology

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● FRD has self-developed 11 categories over 80 products which provide total thermal solutions
● Provide 1-120 W/m·K widely conductivity grades
● Compliant with Canada and USA Flammable Retardant UL 94V0 Recognition
● Thermal FIP products available

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Thermal Interface Material

2026 - 01 - 07

型号：

● FRD has self-developed 11 categories over 80 products which provide total thermal solutions● Provide 1-120 W/m·K widely conductivity grades● Compliant with Canada and USA Flammable Retardant UL 94V0 Recognition● Thermal FIP products available

HP-RTM

2024 - 09 - 18

型号：

HP-RTM (High Pressure Resin Transfer Molding) is the abbreviation of high pressure resin transfer molding process. It refers to the molding process of obtaining composite products by using high pressure to mix resin and inject it into a vacuum closed mold pre-paved with fiber reinforced materials, and then through resin flow filling, impregnation, curing and demoulding.Application examples on EV battery pack

Fabric Over Foam & Conductive Foam

2016 - 08 - 29

型号：

● Full range of products can be customized according to customers’ specific needs● Independent R&D technology of 150℃ high temperature● Halogen-free Flame Retardant (UL94-V0)